HOT SPOT EFFECTS IN HYBRID CIRCUITS

被引:7
作者
ROTTIERS, L
DEMEY, G
机构
[1] Ghent State Univ, Belg
来源
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1988年 / 11卷 / 03期
关键词
SUBSTRATES -- Heat Transfer;
D O I
10.1109/33.16653
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The temperature field due to a hot spot is investigated using a two-dimensional, an improved two-dimensional, and a three-dimensional analysis. It is shown that if the dimensions of the heat source are less than a critical distance, a two-dimensional approach fails even for substrates with a high thermal conductivity. A combined model involving a local zooming is proposed.
引用
收藏
页码:274 / 278
页数:5
相关论文
共 16 条
[1]  
CASSELMAN G, 1985, HYBRID CIRCUITS, V8, P10
[2]  
CASSELMAN G, 1986, HYBRID CIRCUITS, V10, P9
[3]   COMPUTERIZED THERMAL-ANALYSIS OF HYBRID CIRCUITS [J].
DAVID, RF .
IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1977, 13 (03) :283-290
[4]  
DEAN DJ, 1985, THERMAL DESIGN ELECT
[5]   EFFECT OF SOME COMPOSITE STRUCTURES ON THERMAL RESISTANCE OF SUBSTRATES AND INTEGRATED-CIRCUIT CHIPS [J].
ELLISON, GN .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1973, ED20 (03) :233-239
[6]   THERMAL DESIGN OF AN LSI SINGLE-CHIP PACKAGE [J].
ELLISON, GN .
IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1976, 12 (04) :371-378
[7]  
ELLISON GN, 1984, ISHM6984003 TECHN MO, P295
[8]  
ELLISON GN, 1978, INT C HYBRID MICROEL
[9]  
FERRARIS GP, 1979, 2ND P EUR HYBR MICR, P61
[10]   A COMPUTER-AIDED-DESIGN SYSTEM FOR HYBRID CIRCUITS [J].
HURT, JC ;
MOHR, CL .
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1980, 3 (04) :525-535