GENERAL-ASPECTS OF BARRIER LAYERS FOR VERY-LARGE-SCALE INTEGRATION APPLICATIONS .1. CONCEPTS

被引:33
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HO, PS
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10.1016/0040-6090(82)90514-4
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T [工业技术];
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08 ;
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页码:301 / 316
页数:16
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  • [1] REDUCTION OF ELECTROMIGRATION IN ALUMINUM FILMS BY COPPER DOPING
    AMES, I
    DHEURLE, FM
    HORSTMANN, RE
    [J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1970, 14 (04) : 461 - +
  • [2] SPECIAL ASPECTS OF DIFFUSION IN THIN-FILMS
    BALLUFFI, RW
    BLAKELY, JM
    [J]. THIN SOLID FILMS, 1975, 25 (02) : 363 - 392
  • [3] THERMAL-STABILITY OF TITANIUM NITRIDE FOR SHALLOW JUNCTION SOLAR-CELL CONTACTS
    CHEUNG, NW
    VONSEEFELD, H
    NICOLET, MA
    HO, F
    ILES, P
    [J]. JOURNAL OF APPLIED PHYSICS, 1981, 52 (06) : 4297 - 4299
  • [4] d'Heurle F. M., 1978, Thin films. Interdiffusion and reactions, P243
  • [5] DESIGN OF ION-IMPLANTED MOSFETS WITH VERY SMALL PHYSICAL DIMENSIONS
    DENNARD, RH
    GAENSSLEN, FH
    YU, HN
    RIDEOUT, VL
    BASSOUS, E
    LEBLANC, AR
    [J]. IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1974, SC 9 (05) : 256 - 268
  • [6] DHeurle F. M., 1973, PHYS THIN FILMS, V7, P257
  • [7] Selective x-ray diffraction from artificially stratified metal films deposited by evaporation
    Dumond, JWM
    Youtz, JP
    [J]. PHYSICAL REVIEW, 1935, 48 (08): : 703 - 703
  • [8] DUMOND JWM, 1940, J APPL PHYS, V11, P557
  • [9] STUDY OF AL-PD2SI CONTACTS ON SI
    GRINOLDS, H
    ROBINSON, GY
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1977, 14 (01): : 75 - 78
  • [10] DIFFUSION-PROCESSES IN THIN-FILMS
    GUPTA, D
    HO, PS
    [J]. THIN SOLID FILMS, 1980, 72 (03) : 399 - 418