LOW-TEMPERATURE SILICON EPITAXY BY LOW-ENERGY BIAS SPUTTERING

被引:39
作者
OHMI, T
MATSUDO, K
SHIBATA, T
ICHIKAWA, T
IWABUCHI, H
机构
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D O I
10.1063/1.99914
中图分类号
O59 [应用物理学];
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页码:364 / 366
页数:3
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共 8 条
[1]   LOW-TEMPERATURE SILICON EPITAXY BY PARTIALLY IONIZED VAPOR-DEPOSITION [J].
ITOH, T ;
NAKAMURA, T ;
MUROMACHI, M ;
SUGIYAMA, T .
JAPANESE JOURNAL OF APPLIED PHYSICS, 1977, 16 (04) :553-557
[2]   ROOM-TEMPERATURE COPPER METALLIZATION FOR ULTRALARGE-SCALE INTEGRATED-CIRCUITS BY A LOW KINETIC-ENERGY PARTICLE PROCESS [J].
OHMI, T ;
SAITO, T ;
SHIBATA, T ;
NITTA, T .
APPLIED PHYSICS LETTERS, 1988, 52 (26) :2236-2238
[3]   INSITU SUBSTRATE-SURFACE CLEANING FOR VERY LOW-TEMPERATURE SILICON EPITAXY BY LOW-KINETIC-ENERGY PARTICLE BOMBARDMENT [J].
OHMI, T ;
ICHIKAWA, T ;
SHIBATA, T ;
MATSUDO, K ;
IWABUCHI, H .
APPLIED PHYSICS LETTERS, 1988, 53 (01) :45-47
[4]   HIGH-RATE GROWTH AT LOW-TEMPERATURES BY FREE-JET MOLECULAR-FLOW - SURFACE-REACTION FILM-FORMATION TECHNOLOGY [J].
OHMI, T ;
MORITA, M ;
KOCHI, T ;
KOSUGI, M ;
KUMAGAI, H ;
ITOH, M .
APPLIED PHYSICS LETTERS, 1988, 52 (14) :1173-1175
[5]  
OHMI T, 1987, P ELECTROCHEMICAL SO, V8711, P761
[6]  
OHMI T, 1987, P ELECTROCHEMICAL SO, V8711, P574
[7]  
OHMI T, 1988, 1ST INT S ADV MAT UL
[8]   CRYSTALLINE AND ELECTRICAL CHARACTERISTICS OF SILICON FILMS DEPOSITED BY IONIZED-CLUSTER-BEAMS [J].
YAMADA, I ;
SARIS, FW ;
TAKAGI, T ;
MATSUBARA, K ;
TAKAOKA, H ;
ISHIYAMA, S .
JAPANESE JOURNAL OF APPLIED PHYSICS, 1980, 19 (04) :L181-L184