2-LAYER PLANARIZATION PROCESS

[1] A 3-LAYER RESIST SYSTEM FOR DEEP UV AND RIE MICROLITHOGRAPHY ON NONPLANAR SURFACES [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1983, 130 (02) : 478 - 484

[2] BATCHELDER T, 1983, SOLID STATE TECHNOL, V26, P211

[3] EIDENT GC, 1984, ELECTROCHEMICAL SOC, P248

[4] DRY ETCHING TECHNOLOGY FOR 1-MU-M VLSI FABRICATION [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 1981, 28 (11) : 1323 - 1331

[5] PROPERTIES OF THIN POLYIMIDE FILMS [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1980, 127 (10) : 2216 - 2220

[6] PLANARIZATION PROPERTIES OF RESIST AND POLYIMIDE COATINGS [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1983, 130 (07) : 1543 - 1548

[7] WILSON RH, 1984, ELECTROCHEMICAL SOC, P609

[1] A 3-LAYER RESIST SYSTEM FOR DEEP UV AND RIE MICROLITHOGRAPHY ON NONPLANAR SURFACES [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1983, 130 (02) : 478 - 484

[2] BATCHELDER T, 1983, SOLID STATE TECHNOL, V26, P211

[3] EIDENT GC, 1984, ELECTROCHEMICAL SOC, P248

[4] DRY ETCHING TECHNOLOGY FOR 1-MU-M VLSI FABRICATION [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 1981, 28 (11) : 1323 - 1331

[5] PROPERTIES OF THIN POLYIMIDE FILMS [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1980, 127 (10) : 2216 - 2220

[6] PLANARIZATION PROPERTIES OF RESIST AND POLYIMIDE COATINGS [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1983, 130 (07) : 1543 - 1548

[7] WILSON RH, 1984, ELECTROCHEMICAL SOC, P609