TITANIUM NITRIDE DEPOSITION USING CHEMICAL BEAMS OF METALORGANIC PRECURSORS AND ECR PLASMA-ACTIVATED NITROGEN

被引:4
作者
TSUDA, H
NUMASAWA, Y
机构
[1] Microelectronics Research Laboratories, NEC Corporation, Ibaraki, 305, 34 Miyukigaoka, Tsukuba
来源
JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS | 1995年 / 34卷 / 6A期
关键词
METALORGANIC; RESISTIVITY; CONTACT HOLE; TIN; ECR; CVD; CBD;
D O I
10.1143/JJAP.34.L691
中图分类号
O59 [应用物理学];
学科分类号
摘要
This letter presents TiN deposition by using chemical beams. In this deposition, nitrogen activated by electron cyclotron resonance, and metalorganic precursors of titanium are supplied onto a substrate as molecular beams in a high vacuum. Dependencies of deposition rate, film composition and resistivity on d.c. bias applied to the substrate show that positive ions are important in deposition and in improving film properties. Moreover, controlling a particular reaction area and the angle of incidence of the molecular beam results in bottom coverage of more than 80% in the contact holes with an aspect ratio of about 3.
引用
收藏
页码:L691 / L693
页数:3
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