DETERMINATION OF THE ELASTIC-MODULUS AND RESIDUAL-STRESSES IN CERAMIC COATINGS USING A STRAIN-GAUGE

被引:39
作者
CHIU, CC
机构
[1] Department of Metallurgy, Mechanics, and Materials Science, Michigan State University, East Lansing, Michigan
关键词
coatings; elasticity; graphite; silicon carbide; stress;
D O I
10.1111/j.1151-2916.1990.tb05258.x
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Formulas based on the beam theory are derived for calculating the in‐plane elastic modulus and residual stresses in ceramic coatings. In addition to theoretical derivation, experimental data for SiC coating/graphite substrate composites are proposed. The results indicate that the modulus of SiC coatings is 359 GPa. The residual stresses are in compression and are functions of the ratio of substrate thickness to coating thickness. Copyright © 1990, Wiley Blackwell. All rights reserved
引用
收藏
页码:1999 / 2005
页数:7
相关论文
共 23 条
[1]   STRESS DETERMINATION IN OPAQUE MATERIALS [J].
BEAUCHAMP, EK ;
ALTHERR, RH .
JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 1971, 54 (02) :103-+
[2]   CALCULATION OF STRESS IN ELECTRODEPOSITS FROM THE CURVATURE OF A PLATED STRIP [J].
BRENNER, A ;
SENDEROFF, S .
JOURNAL OF RESEARCH OF THE NATIONAL BUREAU OF STANDARDS, 1949, 42 (02) :105-123
[3]  
Bunshah R. F., 1982, DEPOSITION TECHNOLOG
[4]  
CORCORAN EM, 1969, J PAINT TECHNOL, V41, P635
[5]   MECHANICAL-PROPERTIES OF COATED SYSTEMS [J].
GRUNLING, HW ;
SCHNEIDER, K ;
SINGHEISER, L .
MATERIALS SCIENCE AND ENGINEERING, 1987, 88 :177-189
[6]  
GRUVER RM, 1971, AM CERAM SOC BULL, V50, P749
[7]   MEASUREMENT OF STRAINS AT SI-SIO2 INTERFACE [J].
JACCODINE, RJ ;
SCHLEGEL, WA .
JOURNAL OF APPLIED PHYSICS, 1966, 37 (06) :2429-+
[8]   MICROHARDNESS AND INTERNAL-STRESS OF SI3N4-SIC FILMS PREPARED BY PLASMA CVD [J].
KAMATA, K ;
AIZAWA, N ;
MORIYAMA, M .
JOURNAL OF MATERIALS SCIENCE LETTERS, 1986, 5 (10) :1055-1057
[9]   LOCAL STRESS MEASUREMENT IN THIN THERMAL SIO2 FILMS ON SI-SUBSTRATES [J].
LIN, SCH ;
PUGACZMU.I .
JOURNAL OF APPLIED PHYSICS, 1972, 43 (01) :119-&
[10]  
NEAVE H, 1988, DISTRIBUTION FREE TE, P109