EFFECTS OF GUANIDINE-HYDROCHLORIDE ON ELECTROLESS COPPER DEPOSITION

被引：14

作者：

HUNG, A

机构：

[1] Ming-Hsin Engineering Coll, Hsin-chu, Taiwan, Ming-Hsin Engineering Coll, Hsin-chu, Taiwan

来源：

JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 1986年 / 133卷 / 07期

关键词：

D O I：

10.1149/1.2108869

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

引用

页码：1350 / 1353

页数：4

共 15 条

[1]

[Anonymous], 1981, Pat. USA, Patent No. [US4301196A, 4301196]

[2] KINETICS OF ELECTROLESS COPPER PLATING .3. MASS-TRANSPORT EFFECTS [J].

DONAHUE, FM .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1980, 127 (01) :51-55

[3] THE EFFECT OF PH ON ELECTROLESS COPPER DEPOSITION [J].

DUFFY, J ;

PEARSON, L ;

PAUNOVIC, M .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1983, 130 (04) :876-880

[4] RATE OF ELECTROLESS COPPER DEPOSITION BY FORMALDEHYDE REDUCTION [J].

DUMESIC, J ;

KOUTSKY, JA ;

CHAPMAN, TW .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1974, 121 (11) :1405-1412

[5] EFFECTS OF THIOUREA AND GUANIDINE-HYDROCHLORIDE ON ELECTROLESS COPPER PLATING [J].

HUNG, A .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1985, 132 (05) :1047-1049

[6]

MOLENAAR A, 1974, PLATING, V61, P649

[7]

NUZZI FJ, 1983, PLAT SURF FINISH, V70, P51

[8]

PAUNOVIC M, 1985, PLAT SURF FINISH, V72, P52

[9] THE EFFECT OF SOME ADDITIVES ON ELECTROLESS COPPER DEPOSITION [J].

PAUNOVIC, M ;

ARNDT, R .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1983, 130 (04) :794-799

[10]

Paunovic M., 1968, PLATING, V55, P1161

← 1 2 →