DEVICE, CIRCUIT, AND TECHNOLOGY SCALING TO MICRON AND SUB-MICRON DIMENSIONS

被引：33

作者：

REISMAN, A

机构：

[1] N CAROLINA STATE UNIV,DEPT ELECT ENGN,RALEIGH,NC 27650

[2] IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598

来源：

PROCEEDINGS OF THE IEEE | 1983年 / 71卷 / 05期

关键词：

D O I：

10.1109/PROC.1983.12638

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：550 / 565

页数：16

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