共 18 条
[1]
MULTICHIP PACKAGING TECHNOLOGY WITH LASER-PATTERNED INTERCONNECTS
[J].
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY,
1989, 12 (04)
:646-649
[3]
CRONSON HM, 1990, ARFTG ON WAFER MEASU, V2
[5]
Davidson A., 1990, 36th ARFTG Conference Digest. Fall 1990. Automatic RF Techniques Group, P57, DOI 10.1109/ARFTG.1990.323996
[6]
GODSHALK E, 1990, ON WAFER MEASUREMENT, V2
[7]
DESIGN OF PLANAR RECTANGULAR MICROELECTRONIC INDUCTORS
[J].
IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING,
1974, PH10 (02)
:101-109
[8]
GROVER FW, 1946, INDUCTANCE CALCULATI, P17
[9]
JONES KE, 1987, MICROWAVE J, P177
[10]
MAJIDIAHY R, 1989, 1989 IEE MTT S INT M, V1, P299