ELECTRICAL METHODS FOR CHARACTERIZING DIRECTLY BONDED SILICON SILICON INTERFACES

被引:19
作者
BENGTSSON, S
ENGSTROM, O
机构
[1] Department of Solid State Electronics, Chalmers University of Technology, Goteborg
来源
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS | 1991年 / 30卷 / 02期
关键词
SILICON WAFER BONDING; SILICON DIRECT BONDING (SDB); SI/SI-INTERFACE; ELECTRICAL CHARACTERIZATION; INTERFACE CHARGE; INTERFACE STATES;
D O I
10.1143/JJAP.30.356
中图分类号
O59 [应用物理学];
学科分类号
摘要
Measurement methods for characterizing the electrical properties of directly bonded Si/Si n-type/n-type or p-type/p-type interfaces are presented. The density of interface states in the bandgap of the semiconductor and the density of interface charge at the bonded interface are determined from measurements of current and capacitance vs applied voltage. The density of interface charge is thus obtained from two different measurements. The two measurement methods are compared and the limitations of the methods are discussed. Also, a high density of interface states at the bonded interface gives rise to a current transient when a voltage step is applied. This can be used as a qualitative estimate of the interface properties.
引用
收藏
页码:356 / 361
页数:6
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