MICROSTRUCTURAL CHANGES IN VAPOR-DEPOSITED SILVER, COPPER AND GOLD-FILMS INVESTIGATED BY INTERNAL-STRESS MEASUREMENTS

被引：32

作者：

KOCH, R

ABERMANN, R

机构：

[1] Univ of Innsbruck, Innsbruck, Austria, Univ of Innsbruck, Innsbruck, Austria

来源：

THIN SOLID FILMS | 1986年 / 140卷 / 02期

关键词：

D O I：

10.1016/0040-6090(86)90265-8

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

SILVER AND ALLOYS

引用

页码：217 / 226

页数：10

共 12 条

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[9] EFFECT OF EXPOSURE TO AIR ON SILVER AND GOLD FILMS DEPOSITED IN ULTRA-HIGH VACUUM [J].

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[10] ON THE INFLUENCE OF THERMAL EFFECTS ON INTERNAL-STRESS MEASUREMENTS DURING AND AFTER DEPOSITION OF SILVER, GOLD AND COPPER-FILMS [J].

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