ADHESION, INTERNAL-STRESS, MICROSTRUCTURE AND RESISTIVITY OF THIN ALLOY-FILMS OF ALUMINUM, COPPER AND SILVER

被引：14

作者：

DIRKS, AG

VANDENBROEK, JJ

机构：

来源：

THIN SOLID FILMS | 1982年 / 96卷 / 03期

关键词：

D O I：

10.1016/0040-6090(82)90250-4

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

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页码：257 / 263

页数：7

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