A MAGNETRON SPUTTER ION PLATING SYSTEM

被引:27
作者
TEER, DG
机构
[1] D.G. Teer Coating Services Ltd, United Kingdom
关键词
Coating Techniques--Applications - Coatings--Mechanical Properties - Sputtering--Applications - Titanium Compounds--Applications;
D O I
10.1016/0257-8972(88)90030-8
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
A new type of system for the deposition of hard coatings on cutting tools has been designed, constructed and tested. The system is based on the well-established principles of magnetron sputter source ion plating but uses a long narrow cylindrical chamber with three magnetrons running the full length of the chamber. This geometry is such that all samples are in the same coating and plasma environment, ensuring uniformity of thickness, adhesion, stoichiometry and structure of the coating over the surface of each sample and for all samples. It also results in a very efficient use of chamber volume, fast pumpdowns, fast deposition times and therefore high productivity.
引用
收藏
页码:901 / 907
页数:7
相关论文
共 16 条
[1]   TIN COATINGS ON STEEL [J].
BUHL, R ;
PULKER, HK ;
MOLL, E .
THIN SOLID FILMS, 1981, 80 (1-3) :265-270
[2]   ELECTROCHEMICALLY MEASURED POROSITY OF MAGNETRON SPUTTERED TIN FILMS DEPOSITED AT VARIOUS SUBSTRATE ORIENTATIONS [J].
FRELLER, H ;
LORENZ, HP .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1986, 4 (06) :2691-2694
[3]   ION PLATING WITH AN ARC SOURCE [J].
HATTO, PW ;
TEER, DG .
VACUUM, 1986, 36 (1-3) :67-69
[4]   PHYSICAL VAPOR-DEPOSITION OF THICK CR AND ITS CARBIDE AND NITRIDE FILMS BY HOLLOW-CATHODE DISCHARGE [J].
KOMIYA, S ;
TSURUOKA, K .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1976, 13 (01) :520-524
[5]  
MATHEWS A, 1980, THIN SOLID FILMS, V72, P541
[6]  
MOLL E, 1980, Patent No. 4197175
[7]   A HIGH-RATE SPUTTERING PROCESS FOR THE FORMATION OF HARD FRICTION-REDUCING TIN COATINGS ON TOOLS [J].
MUNZ, WD ;
HOFMANN, D ;
HARTIG, K .
THIN SOLID FILMS, 1982, 96 (01) :79-86
[8]  
MUNZ WD, 1986, J VAC SCI TECHNOL A, V4, P2717, DOI 10.1116/1.573713
[9]  
MUNZ WD, 1985, CEI COURSE NITRIDE C
[10]   ANALYSIS OF A REACTIVE SPUTTER ION PLATING DISCHARGE FOR TIN DEPOSITION USING OPTICAL-EMISSION SPECTROSCOPY [J].
RICARD, A ;
MICHEL, H ;
JACQUOT, P ;
GANTOIS, M .
THIN SOLID FILMS, 1985, 124 (01) :67-73