MODELING OF REACTIVE SPUTTERING OF TITANIUM BORIDE

被引：8

作者：

LARSSON, T

BERG, S

BLOM, HO

机构：

来源：

THIN SOLID FILMS | 1989年 / 172卷 / 02期

关键词：

D O I：

10.1016/0040-6090(89)90652-4

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：241 / 249

页数：9

共 13 条

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BERG, S ;

LARSSON, T ;

BLOM, HO .

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[2] PREDICTING THIN-FILM STOICHIOMETRY IN REACTIVE SPUTTERING [J].

BERG, S ;

LARSSON, T ;

NENDER, C ;

BLOM, HO .

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[3] MODELING OF REACTIVE SPUTTERING OF COMPOUND MATERIALS [J].

BERG, S ;

BLOM, HO ;

LARSSON, T ;

NENDER, C .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1987, 5 (02) :202-207

[4] STOICHIOMETRY DETERMINATION OF REACTIVELY SPUTTERED TITANIUM-SILICIDE [J].

BLOM, HO ;

BERG, S ;

OSTLING, M ;

PETERSSON, S .

VACUUM, 1982, 32 (10-1) :665-667

[5]

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[6]

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[7] GLOW-DISCHARGE OPTICAL SPECTROSCOPY FOR MONITORING SPUTTER DEPOSITED FILM THICKNESS [J].

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SEQUEDAO.F .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1973, 10 (06) :1144-1149

[8] A PHYSICAL MODEL FOR ELIMINATING INSTABILITIES IN REACTIVE SPUTTERING [J].

LARSSON, T ;

BLOM, HO ;

NENDER, C ;

BERG, S .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1988, 6 (03) :1832-1836

[9]

LARSSON T, UNPUB VACUUM

[10]

LARSSON T, UNPUB THIN SOLID FIL

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