ACTIVATION-ENERGY FOR ELECTROTRANSPORT IN THIN SILVER AND GOLD-FILMS

被引：89

作者：

HUMMEL, RE ^{[1
]}

GEIER, HJ ^{[1
]}

机构：

[1] UNIV FLORIDA,DEPT MAT SCI & ENGN,GAINESVILLE,FL 32601

来源：

THIN SOLID FILMS | 1975年 / 25卷 / 02期

关键词：

D O I：

10.1016/0040-6090(75)90053-X

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：335 / 342

页数：8

共 20 条

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GHATE, PB ;

FULLER, CR ;

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[3] ELECTROMIGRATION IN THIN SILVER, COPPER, GOLD, INDIUM, TIN, LEAD AND MAGNESIUM FILMS [J].

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HUMMEL, RE .

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[4] ACTIVATION-ENERGY FOR ELECTROMIGRATION AND GRAIN-BOUNDARY SELF-DIFFUSION IN GOLD [J].

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DHEURLE, FM .

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[5]

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TURNBULL, D .

JOURNAL OF APPLIED PHYSICS, 1951, 22 (05) :634-639

[7] DIRECTION OF ELECTROMIGRATION IN THIN SILVER, GOLD, AND COPPER FILMS [J].

HUMMEL, RE ;

BREITLING, RM .

APPLIED PHYSICS LETTERS, 1971, 18 (09) :373-+

[8]

HUMMEL RE, TO BE PUBLISHED

[9] CURRENT-INDUCED MARKER MOTION IN GOLD WIRES [J].

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GRONE, AR .

JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS, 1961, 20 (1-2) :76-87

[10] ELECTROMIGRATION IN THIN GOLD FILMS [J].

KLEIN, BJ .

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