MEASUREMENT OF A DAMAGED LAYER THICKNESS WITH REFLECTION ACOUSTIC MICROSCOPE

被引：12

作者：

ISHIKAWA, I

KANDA, H

KATAKURA, K

SEMBA, T

机构：

[1] FUKUOKA INST TECHNOL,HIGASHI KU,FUKUOKA 81102,JAPAN

[2] HITACHI LTD,CENT RES LAB,KOKUBUNJI,TOKYO 185,JAPAN

来源：

IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL | 1989年 / 36卷 / 06期

关键词：

D O I：

10.1109/58.39108

中图分类号：

O42 [声学];

学科分类号：

070206 ; 082403 ;

摘要：

引用

页码：587 / 592

页数：6

共 12 条

[1]

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[3]

ISHIKAWA I, 1987, B JAPAN SOC PREC ENG, V21

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KINO, GS .

APPLIED PHYSICS LETTERS, 1982, 41 (12) :1124-1126

[5]

MAXFIELD BW, 1981 P IEEE ULTR S C, P561

[6] RAY INTERPRETATION OF THE MATERIAL SIGNATURE IN THE ACOUSTIC MICROSCOPE [J].

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[7] ACOUSTIC MICROSCOPY WITH MECHANICAL SCANNING - REVIEW [J].

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ATALAR, A ;

WICKRAMASINGHE, HK .

PROCEEDINGS OF THE IEEE, 1979, 67 (08) :1092-1114

[8]

WEGLEFIN RD, 1985, APPL PHYS LETT, V40, P347

[9] MODEL FOR PREDICTING ACOUSTIC MATERIAL SIGNATURES [J].

WEGLEIN, RD .

APPLIED PHYSICS LETTERS, 1979, 34 (03) :179-181

[10] ACOUSTIC MICROSCOPY APPLIED TO SAW DISPERSION AND FILM THICKNESS MEASUREMENT [J].

WEGLEIN, RD .

IEEE TRANSACTIONS ON SONICS AND ULTRASONICS, 1980, 27 (02) :82-86

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