POLYSILICON N+P-N+ STRUCTURES FOR MEMORY REDUNDANCY

被引:9
作者
GREVE, DW
TRAN, LV
机构
关键词
D O I
10.1109/T-ED.1982.20873
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
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页码:1313 / 1318
页数:6
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共 17 条
[1]  
ANTHONY TR, 1981, J APPL PHYS, V51, P6356
[2]  
BINDELS JFM, 1981, ISSCC DIGEST TECHNIC, P82
[3]   HIGH-SPEED DROPLET MIGRATION IN SILICON [J].
CLINE, HE ;
ANTHONY, TR .
JOURNAL OF APPLIED PHYSICS, 1976, 47 (06) :2325-2331
[4]  
CROOK DL, 1981, 19TH ANN P REL PHYS, P1
[5]   GRAIN-BOUNDARY STATES AND THE CHARACTERISTICS OF LATERAL POLYSILICON DIODES [J].
DEGRAAFF, HC ;
HUYBERS, M ;
DEGROOT, JG .
SOLID-STATE ELECTRONICS, 1982, 25 (01) :67-71
[6]  
EATON SS, 1981, ISSCC DIG TECH PAPER, P84
[7]   PROGRAMMING MECHANISM OF POLYSILICON RESISTOR FUSES [J].
GREVE, DW .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1982, 29 (04) :719-724
[8]  
Kodera H., 1963, JAP J APPL PHYS, V2, P212, DOI [10.1143/JJAP.2.212, DOI 10.1143/JJAP.2.212]
[9]  
KOKKONEN K, 1981, ISSCC DIG TECH PAPER, P80
[10]   A FAULT-TOLERANT 256K RAM FABRICATED WITH MOLYBDENUM-POLYSILICON TECHNOLOGY [J].
MANO, T ;
TAKEYA, K ;
WATANABE, T ;
IEDA, N ;
KIUCHI, K ;
ARAI, E ;
OGAWA, T ;
HIRATA, K .
IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1980, 15 (05) :865-872