HILLOCK FORMATION DURING ELECTROMIGRATION IN CU AND AL THIN-FILMS - 3-DIMENSIONAL GRAIN-GROWTH

被引:41
作者
GLADKIKH, A
LEREAH, Y
GLICKMAN, E
KARPOVSKI, M
PALEVSKI, A
SCHUBERT, J
机构
[1] HEBREW UNIV JERUSALEM,GRAD SCH APPL SCI & TECHNOL,IL-91904 JERUSALEM,ISRAEL
[2] TEL AVIV UNIV,SCH PHYS & ASTRON,IL-69978 RAMAT AVIV,ISRAEL
[3] INTEL,IL-91031 JERUSALEM,ISRAEL
关键词
D O I
10.1063/1.113240
中图分类号
O59 [应用物理学];
学科分类号
摘要
The evolution of microstructure in Al and Cu thin film lines during electromigration has been studied using a transmission electron microscopy. Grain boundary migration was found to be critically involved in the electromigration induced hillock formation that can be described as a three-dimensional growth of a single grain.© 1995 American Institute of Physics.
引用
收藏
页码:1214 / 1215
页数:2
相关论文
共 9 条
[1]  
HIRSH PB, 1965, ELECTRON MICROSCOPY
[2]  
HU CK, 1992, MATER RES SOC SYMP P, V265, P171, DOI 10.1557/PROC-265-171
[3]   ELECTROMIGRATION PROPERTIES OF ELECTROLESS PLATED CU METALLIZATION [J].
KANG, HK ;
CHO, JSH ;
WONG, SS .
IEEE ELECTRON DEVICE LETTERS, 1992, 13 (09) :448-450
[4]   INSITU OBSERVATION OF ELECTROMIGRATION IN CU FILM USING SCANNING MU-REFLECTION HIGH-ENERGY ELECTRON-DIFFRACTION MICROSCOPE [J].
MASU, K ;
HIURA, Y ;
TSUBOUCHI, K ;
OHMI, T ;
MIKOSHIBA, N .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1991, 30 (12B) :3642-3645
[5]   ADVANCED MULTILAYER METALLIZATION SCHEMES WITH COPPER AS INTERCONNECTION METAL [J].
MURARKA, SP ;
GUTMANN, RJ ;
KALOYEROS, AE ;
LANFORD, WA .
THIN SOLID FILMS, 1993, 236 (1-2) :257-266
[6]   ELECTRICAL-PROPERTIES OF GIANT-GRAIN COPPER THIN-FILMS FORMED BY A LOW KINETIC-ENERGY PARTICLE PROCESS [J].
NITTA, T ;
OHMI, T ;
OTSUKI, M ;
TAKEWAKI, T ;
SHIBATA, T .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1992, 139 (03) :922-927
[7]   SELECTIVE ELECTROLESS COPPER FOR VLSI INTERCONNECTION [J].
PAI, PL ;
TING, CH .
IEEE ELECTRON DEVICE LETTERS, 1989, 10 (09) :423-425
[8]   ACTIVATION-ENERGY FOR ELECTROMIGRATION IN CU FILMS [J].
PARK, CW ;
VOOK, RW .
APPLIED PHYSICS LETTERS, 1991, 59 (02) :175-177
[9]   TEXTURE AND MICROSTRUCTURE OF THIN COPPER-FILMS [J].
TRACY, DP ;
KNORR, DB .
JOURNAL OF ELECTRONIC MATERIALS, 1993, 22 (06) :611-616