PROPERTIES AND MICROELECTRONIC APPLICATIONS OF THIN-FILMS OF REFRACTORY-METAL NITRIDES

被引：262

作者：

WITTMER, M

机构：

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1985年 / 3卷 / 04期

关键词：

D O I：

10.1116/1.573382

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

引用

页码：1797 / 1803

页数：7

共 43 条

[1] INVESTIGATION OF TIN FILMS REACTIVELY SPUTTERED USING A SPUTTER GUN
AHN, KY
WITTMER, M
TING, CY
[J]. THIN SOLID FILMS, 1983, 107 (01) : 45 - 54
[2] [Anonymous], [No title captured]
[3] PLASMA DIAGNOSTICS AND ENERGY TRANSPORT OF A DC DISCHARGE USED FOR SPUTTERING
BALL, DJ
[J]. JOURNAL OF APPLIED PHYSICS, 1972, 43 (07) : 3047 - &
[4] DIFFUSION OF COPPER IN THIN TIN FILMS
CHAMBERLAIN, MB
[J]. THIN SOLID FILMS, 1982, 91 (02) : 155 - 162
[5] CHEUNG N, 1980, P S THIN FILM INTERF, P323
[6] Chu WK., 1978, BACKSCATTERING SPECT
[7] CROWLEY AM, 1970, SOLID STATE ELECTRON, V13, P403
[8] INFLUENCE OF BIAS ON DEPOSITION OF METALLIC-FILMS IN RF AND DC SPUTTERING
CUOMO, JJ
GAMBINO, RJ
ROSENBER.R
[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1974, 11 (01): : 34 - 40
[9] FILON A, 1975, J PHYS F MET PHYS, V5, P468
[10] THE MICROSTRUCTURE OF REACTIVELY SPUTTERED TI-N FILMS
HIBBS, MK
SUNDGREN, JE
JACOBSON, BE
JOHANSSON, BO
[J]. THIN SOLID FILMS, 1983, 107 (02) : 149 - 157