ELASTOPLASTIC ANALYSIS OF SURFACE-MOUNT SOLDER JOINTS

被引：33

作者：

LAU, JH

RICE, DW

AVERY, PA

机构：

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1987年 / 10卷 / 03期

关键词：

D O I：

10.1109/TCHMT.1987.1134753

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：346 / 357

页数：12

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