PRODUCTION OF THIN TUNGSTEN FILMS

被引：3

作者：

BALALIKIN, NI ^{[1
]}

BUCH, J ^{[1
]}

KATRASEV, VV ^{[1
]}

SKRYPNIK, AV ^{[1
]}

机构：

[1] DUBNA JOINT NUCL RES INST,NEW ACCELERAT METHODS DEPT,DUBNA,USSR

来源：

THIN SOLID FILMS | 1976年 / 38卷 / 03期

关键词：

D O I：

10.1016/0040-6090(76)90004-3

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：255 / 260

页数：6

共 6 条

[1]

BALALIKIN NI, 1972, P96855 JINR PREPR

[2] SUPERCONDUCTIVITY IN BETA-TUNGSTEN FILMS [J].

BASAVAIAH, S ;

POLLACK, SR .

JOURNAL OF APPLIED PHYSICS, 1968, 39 (12) :5548-+

[3] FACE-CENTERED-CUBIC TUNGSTEN FILMS OBTAINED BY [J].

CHOPRA, KL ;

RANDLETT, MR ;

DUFF, RH .

APPLIED PHYSICS LETTERS, 1966, 9 (11) :402-&

[4] MICROSTRUCTURE, GROWTH, RESISTIVITY, AND STRESSES IN THIN TUNGSTEN FILMS DEPOSITED BY RF SPUTTERING [J].

PETROFF, P ;

SHENG, TT ;

SINHA, AK ;

ROZGONYI, GA ;

ALEXANDER, FB .

JOURNAL OF APPLIED PHYSICS, 1973, 44 (06) :2545-2554

[5] CONTROL OF RESISTIVITY, MICROSTRUCTURE, AND STRESS IN ELECTRON-BEAM EVAPORATED TUNGSTEN FILMS [J].

SINHA, AK ;

SMITH, TE ;

SHENG, TT ;

AXELROD, NN .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1973, 10 (03) :436-444

[6] TUNGSTEN METALLIZATION FOR LSI APPLICATIONS [J].

WAGNER, RS ;

SINHA, AK ;

SHENG, TT ;

LEVINSTEIN, HJ ;

ALEXANDER, FB .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1974, 11 (03) :582-590

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