AN ETCH-RATE STUDY OF THERMALLY ANNEALED LTCVD SIO2-FILMS AS A FUNCTION OF INITIAL DEPOSITION CONDITIONS

被引：12

作者：

COBIANU, C

PAVELESCU, C

机构：

来源：

JOURNAL OF MATERIALS SCIENCE LETTERS | 1984年 / 3卷 / 11期

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D O I：

10.1007/BF00720334

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

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页码：979 / 982

页数：4

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