PLASMA PROCESSING IN MICROELECTRONICS MANUFACTURING

被引：48

作者：

GRAVES, DB

机构：

[1] Univ of California, United States

来源：

AICHE JOURNAL | 1989年 / 35卷 / 01期

关键词：

Chemical Equipment--Reactors - Etching - Integrated Circuits; VLSI--Manufacture; -; Plasmas; Spectroscopy;

D O I：

10.1002/aic.690350102

中图分类号：

TQ [化学工业];

学科分类号：

0817 ;

摘要：

The purposes of this review are to introduce chemical engineers to plasma processing practice and phenomenology; to outline the progress made to date in fundamental studies of discharge physics and chemistry; to indicate areas in which chemical engineers must expand their traditional training to participate in plasma processing research; and finally to suggest how established chemical engineering methodology can be applied to plasma chemical reactors.

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页码：1 / 29

页数：29

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