PRECIPITATION AND SOLID-SOLUTION EFFECTS IN ALUMINUM-COPPER THIN-FILMS AND THEIR INFLUENCE ON ELECTROMIGRATION

被引：18

作者：

WALKER, GA ^{[1
]}

GOLDSMITH, CC ^{[1
]}

机构：

[1] IBM CORP, E FISHKILL LAB, SYST PROD DIV, HOPEWELL JUNCTION, NY 12533 USA

来源：

JOURNAL OF APPLIED PHYSICS | 1973年 / 44卷 / 06期

关键词：

D O I：

10.1063/1.1662595

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：2452 / 2455

页数：4

共 16 条

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[2] REDUCTION OF ELECTROMIGRATION IN ALUMINUM FILMS BY COPPER DOPING [J].

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DHEURLE, FM ;

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[3]

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[4] SURFACE TOPOLOGY CHANGES DURING ELECTROMIGRATION IN METALLIC THIN FILM STRIPES [J].

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[5] ELECTROMIGRATION - A BRIEF SURVEY AND SOME RECENT RESULTS [J].

BLACK, JR .

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[6]

DEAN NA, 1968, ALUMINUM, V1

[7]

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[8]

DHEURLE FM, 1970, MET T, V2, P683

[9]

GAJDA JJ, 1971, P HYBRID MICROELECTR

[10] EFFECT OF ALLOY ADDITIONS ON ELECTROMIGRATION FAILURES IN THIN ALUMINUM FILMS [J].

GANGULEE, A ;

DHEURLE, FM .

APPLIED PHYSICS LETTERS, 1971, 19 (03) :76-&

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