PROCESS MODELING AND DESIGN PROCEDURE FOR IGFET THRESHOLDS

被引:2
作者
GEIPEL, HJ
FORTINO, AG
机构
[1] IBM General Technology Division
关键词
D O I
10.1109/JSSC.1979.1051194
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
An empirically based process modeling system is discussed for determining ion-implant conditions used to achieve specific IGFET thresholds. Experimental techniques are applied to insure consistency between physical process phenomenon and the numerical algorithms employed. Device threshold design results are presented for active and parasitic IGFET's in a dual polysilicon-gate technology. The utility of this design procedure in multistep processes for determining the effects of various parameters such as screen thickness, final peak concentration, dose, and energy are considered. Copyright © 1979 by The Institute of Electrical and Electronics Engineers, Inc.
引用
收藏
页码:430 / 435
页数:6
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