THE MORPHOLOGICAL STABILITY IN SUPERCRITICAL-FLUID CHEMICAL-DEPOSITION OF FILMS NEAR THE CRITICAL-POINT

In this paper, the results of experimental and theoretical studies of the chemical deposition of copper films from metalorganic compounds dissolved in supercritical C2F6 are reported. The optimal conditions for the growth of highly adherent Cu films with good surface morphology have been determined. A theoretical analysis of the kinetics, the stability of the growth interface together with the transport phenomena inside the supercritical cell shows that the morphological stability is determined by the interplay of three factors. These are the bulk diffusion near the interface, the thermally activated kinetics, and the heat transfer across the deposited layer. It is shown that the morphological stability of the grown film is ensured by an enhanced turbulent convection occurring if the operation pressure and temperature are close enough to the critical point.