Hot-carrier stressing has been shown to degrade hydrogen-passivated p-channel polysilicon-on-insulator (poly-SOI) MOSFET's by two parallel degradation mechanisms. We observe hot-carrier-induced degradation of hydrogen passivation at grain boundaries through the creation of additional donor-type grain boundary states in the channel, as well as hot-electron trapping in the gate oxide. Due to the presence of both of these degradation mechanisms, p-channel polysilicon LDD MOSFET's exhibit anomalous hot-carrier-induced degradation behavior that has not been observed in bulk p-MOSFET's.