EFFECT OF DIRECT-CURRENT ON PRECIPITATION IN QUENCHED AL+4 PERCENT CU TIN FILMS

[11] MADER S, TO BE PUBLISHED

[12] Mott N., 1958, THEORY PROPERTIES ME

[13] ELECTROMIGRATION DAMAGE IN THIN FILMS DUE TO GRAIN BOUNDARY GROOVING PROCESSES [J]. JOURNAL OF APPLIED PHYSICS, 1971, 42 (07) : 2653 - &

[14] CURRENT-INDUCED MASS TRANSPORT IN ALUMINUM [J]. JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS, 1964, 25 (03) : 335 - &

[15] RESISTANCE MONITORING AND EFFECTS OF NONADHESION DURING ELECTROMIGRATION IN ALUMINUM FILMS [J]. APPLIED PHYSICS LETTERS, 1968, 12 (05) : 201 - +

[16] Shewmon P, 2016, DIFFUSION SOLIDS, DOI [10.1007/978-3-319-48206-4, DOI 10.1007/978-3-319-48206-4]

[17] ACTIVATION ENERGY FOR ELECTROMIGRATION IN ALUMINUM FILMS ALLOYED WITH COPPER [J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1971, 15 (05) : 378 - &

[11] MADER S, TO BE PUBLISHED

[12] Mott N., 1958, THEORY PROPERTIES ME

[13] ELECTROMIGRATION DAMAGE IN THIN FILMS DUE TO GRAIN BOUNDARY GROOVING PROCESSES [J]. JOURNAL OF APPLIED PHYSICS, 1971, 42 (07) : 2653 - &

[14] CURRENT-INDUCED MASS TRANSPORT IN ALUMINUM [J]. JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS, 1964, 25 (03) : 335 - &

[15] RESISTANCE MONITORING AND EFFECTS OF NONADHESION DURING ELECTROMIGRATION IN ALUMINUM FILMS [J]. APPLIED PHYSICS LETTERS, 1968, 12 (05) : 201 - +

[16] Shewmon P, 2016, DIFFUSION SOLIDS, DOI [10.1007/978-3-319-48206-4, DOI 10.1007/978-3-319-48206-4]

[17] ACTIVATION ENERGY FOR ELECTROMIGRATION IN ALUMINUM FILMS ALLOYED WITH COPPER [J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1971, 15 (05) : 378 - &