EFFECTS OF STRESS ON METAL-OXIDE-SEMICONDUCTOR STRUCTURES

被引:15
作者
FONASH, SJ [1 ]
机构
[1] BELL TEL LABS INC, MURRAY HILL, NJ 07974 USA
关键词
D O I
10.1063/1.1662009
中图分类号
O59 [应用物理学];
学科分类号
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页码:4607 / 4615
页数:9
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共 23 条
[1]   SYMMETRY OF INTERFACE CHARGE DISTRIBUTION IN THERMALLY OXIDIZED SILICON [J].
ABOWITZ, G ;
ARNOLD, E ;
LADELL, J .
PHYSICAL REVIEW LETTERS, 1967, 18 (14) :543-+
[2]  
ARNDT J, 1971, PHYS CHEM GLASSES, V12, P1
[3]   INFLUENCE OF UNIAXIAL STRESS ON INDIRECT ABSORPTION EDGE IN SILICON AND GERMANIUM [J].
BALSLEV, I .
PHYSICAL REVIEW, 1966, 143 (02) :636-&
[4]  
BROOKS H, 1955, ADV ELECTRONICS ELEC, V7
[5]  
CASTAGNE R, 1968, CR ACAD SCI B PHYS, V267, P866
[6]  
Craig P. P., 1970, Review of Scientific Instruments, V41, P258, DOI 10.1063/1.1684484
[8]   EFFECT OF STRESS ON METAL-SEMICONDUCTOR JUNCTIONS [J].
FONASH, SJ .
SOLID-STATE ELECTRONICS, 1973, 16 (02) :253-263
[9]  
GADZHIEV ND, 1971, SOV PHYS SEMICOND+, V5, P835
[10]   DENSITY OF SIO2-SI INTERFACE STATES - (MOS DEVICES SI OXIDATION 100 DEGREES C O2 + 80 PPM H2O FERMI LEVEL E) [J].
GRAY, PV ;
BROWN, DM .
APPLIED PHYSICS LETTERS, 1966, 8 (02) :31-&