THERMOELECTRIC-POWER MEASUREMENTS IN THIN TIN FILMS

被引：9

作者：

ANGADI, MA

UDACHAN, LA

机构：

来源：

JOURNAL OF PHYSICS D-APPLIED PHYSICS | 1981年 / 14卷 / 07期

关键词：

D O I：

10.1088/0022-3727/14/7/002

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：L103 / L105

页数：3

共 14 条

[1] THE EFFECT OF THE DEPOSITION RATE ON THE ELECTRICAL-RESISTIVITY OF THIN TIN FILMS [J].

ANGADI, MA ;

UDACHAN, LA .

THIN SOLID FILMS, 1981, 78 (03) :299-302

[2] THERMOPOWER AND RESISTIVITY OF THIN METAL FILMS [J].

ANGUS, RK ;

DALGLIESH, ID .

PHYSICS LETTERS A, 1970, A 31 (05) :280-+

[3]

BARUA K, 1976, INDIAN J PURE AP PHY, V14, P496

[4] ROLE OF STRUCTURAL DEFECTS IN ELECTRON-TRANSPORT PROPERTIES OF COPPER-FILMS [J].

CHOPRA, KL ;

SURI, R ;

THAKOOR, AP .

JOURNAL OF APPLIED PHYSICS, 1977, 48 (02) :538-546

[5]

CHOPRA KL, 1970, THIN FILM PHENOMENA, P420

[6] THERMOELECTRIC POWER OF THIN GOLD FILMS [J].

LIN, SF ;

LEONARD, WF .

JOURNAL OF APPLIED PHYSICS, 1971, 42 (09) :3634-&

[7] ELECTRICAL-RESISTIVITY, TCR AND THERMOELECTRIC-POWER OF ANNEALED THIN COPPER-FILMS [J].

RAO, VVRN ;

MOHAN, S ;

REDDY, PJ .

JOURNAL OF PHYSICS D-APPLIED PHYSICS, 1976, 9 (01) :89-94

[8] EIN EXPERIMENTELLER BEITRAG ZUR THERMOKRAFT DUNNER AUFDAMPFSCHICHTEN [J].

REIMER, L .

ZEITSCHRIFT FUR NATURFORSCHUNG PART A-ASTROPHYSIK PHYSIK UND PHYSIKALISCHE CHEMIE, 1957, 12 (06) :525-526

[9]

SAGAWARA H, 1972, THIN SOLID FILMS, V14, P349

[10] ELECTRON-TRANSPORT PROPERTIES OF THIN COPPER-FILMS .1. [J].

SURI, R ;

THAKOOR, AP ;

CHOPRA, KL .

JOURNAL OF APPLIED PHYSICS, 1975, 46 (06) :2574-2582

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