NONDESTRUCTIVE DETERMINATION OF DAMAGE DEPTH PROFILES IN ION-IMPLANTED SEMICONDUCTORS BY SPECTROSCOPIC ELLIPSOMETRY USING DIFFERENT OPTICAL-MODELS

A several-parameter fitting of spectroscopic ellipsometry data is developed to characterize near-surface layers in semiconductors damaged by implantation. The damage depth profiles are described by either rectangular, trapezoid-type, or coupled half-Gaussian (realistic) optical models. The rectangular model has three parameters: the average damage level, the effective thickness of the implanted layer, and the thickness of the native oxide. The trapezoid-type model is enhanced with a fourth parameter, the width of the amorphous/crystalline interface. The realistic optical model consists of a stack of layers with fixed and equal thicknesses. The damage levels are determined by a depth profile function (presently coupled half-Gaussians). Five parameters are used: the position of the maximum, the height, and two standard deviations of the profile, plus the thickness of the native oxide. The complex refractive index of each layer is calculated from the actual damage level by the Bruggeman effective medium approximation. The optical models were tested on Ge-implanted silicon samples and cross checked with high-depth-resolution Rutherford backscattering spectrometry and channeling.