CHARACTERIZATION OF THICK CHROMIUM-CARBON AND CHROMIUM-NITROGEN FILMS DEPOSITED BY HOLLOW-CATHODE DISCHARGE

被引:60
作者
KOMIYA, S [1 ]
ONO, S [1 ]
UMEZU, N [1 ]
NARUSAWA, T [1 ]
机构
[1] ULVAC CORP,CHIGASAKI 253,JAPAN
关键词
D O I
10.1016/0040-6090(77)90230-9
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
引用
收藏
页码:433 / 445
页数:13
相关论文
共 20 条
  • [1] Barrett C. S., 1966, STRUCTURE METALS
  • [2] ACTIVATED REACTIVE EVAPORATION PROCESS FOR HIGH RATE DEPOSITION OF COMPOUNDS
    BUNSHAH, RF
    RAGHURAM, AC
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1972, 9 (06): : 1385 - &
  • [3] DUNCUMB P, 1968, NBS SPEC PUBL, P133
  • [4] Holm R., 1958, ELECTRIC CONTACT HDB, P242
  • [5] ITOH A, 1974, JPN J APPL PHYS, P467
  • [6] HARDNESS AND GRAIN-SIZE RELATIONS FOR THICK CHROMIUM FILMS DEPOSITED BY HOLLOW-CATHODE DISCHARGE
    KOMIYA, S
    ONO, S
    UMEZU, N
    [J]. THIN SOLID FILMS, 1977, 45 (03) : 473 - 479
  • [7] PHYSICAL VAPOR-DEPOSITION OF THICK CR AND ITS CARBIDE AND NITRIDE FILMS BY HOLLOW-CATHODE DISCHARGE
    KOMIYA, S
    TSURUOKA, K
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1976, 13 (01): : 520 - 524
  • [8] KOMIYA S, TO BE PUBLISHED
  • [9] KOMIYA S, 1975, J VAC SCI TECHNOL, V12, P368
  • [10] MAISSEL LI, 1970, HDB THIN FILM TECHNO, pCH4