DISLOCATION NUCLEATION MECHANISM AND DOPING EFFECT IN P-TYPE ZNSE/GAAS

Nitrogen doped ZnSe/GaAs heterostructures grown at 150 and 250-degrees-C were studied by transmission electron microscopy (TEM). The density of threading dislocations and the interfacial dislocation structure in ZnSe/GaAs heterostructures are related to the N-doping concentration. In addition, in-situ TEM heating studies show that Frank partial dislocations formed below critical thickness in N-doped ZnSe/GaAs are the sources for nucleation of a regular array of misfit dislocations at the ZnSe/GaAs interface. By the dissociation of the Frank partial dislocations and interaction reactions between the dislocations, the 60-degrees misfit dislocations form. The Frank partial dislocations bound stacking faults which usually form in pairs at the film/substrate interface. The density of stacking faults increases with increasing N-doping concentration. Thus, at high N-doping levels, the dislocation nucleation sources are close together and not all of the Frank partial dislocations dissociate, so that a high density of threading dislocations results in samples with high N-doping concentrations. The high density of threading dislocations in the ZnSe film are found to be associated with a reduction or saturation of the net carrier density.