ANALYSIS OF DRAIN BREAKDOWN VOLTAGE IN SOI N-CHANNEL MOSFETS

被引:6
作者
HAOND, M [1 ]
COLINGE, JP [1 ]
机构
[1] IMEC,B-3030 LOUVAIN,BELGIUM
关键词
Electric Breakdown - Integrated Circuits; VLSI - Semiconducting Silicon - Transistors; Field Effect;
D O I
10.1049/el:19891099
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The reduction of drain breakdown voltage in SOI nMOSFETs with floating substrate is related to the presence of a parasitic NPN bipolar structure, the base of which is the floating body of the device. Reduction of breakdown voltage (compared to the case where a body contact is used) is shown to be dependent on both channel length and minority carrier lifetime in the SOI material. Conversely, it is shown that mere measurement of MOSFET breakdown voltages can be used to extract the minority carrier lifetime in the SOI material.
引用
收藏
页码:1640 / 1641
页数:2
相关论文
共 8 条
[1]   SINGLE-TRANSISTOR LATCH IN SOI MOSFETS [J].
CHEN, CED ;
MATLOUBIAN, M ;
SUNDARESAN, R ;
MAO, BY ;
WEI, CC ;
POLLACK, GP .
IEEE ELECTRON DEVICE LETTERS, 1988, 9 (12) :636-638
[2]   AN SOI VOLTAGE-CONTROLLED BIPOLAR-MOS DEVICE [J].
COLINGE, JP .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1987, 34 (04) :845-849
[3]   IMPROVED SUBTHRESHOLD CHARACTERISTICS OF N-CHANNEL SOI TRANSISTORS [J].
DAVIS, JR ;
GLACCUM, AE ;
REESON, K ;
HEMMENT, PLF .
IEEE ELECTRON DEVICE LETTERS, 1986, 7 (10) :570-572
[4]  
GROVE AS, 1967, PHYSICS TECHNOLOGY S, P230
[5]   CMOS devices and circuits made in lamp-ZMR SOI films [J].
Haond, M. ;
Dutartre, D. ;
Bensahel, D. ;
Monroy-Aguirre, A. ;
Thouret, S. ;
Chapuis, D. .
Microelectronic Engineering, 1988, 8 (3-4) :201-218
[6]  
SHENG HS, 1989, IEEE T EDUC, V36, P488
[7]   PROPERTIES OF ESFI MOS-TRANSISTORS DUE TO FLOATING SUBSTRATE AND FINITE VOLUME [J].
TIHANYI, J ;
SCHLOTTERER, H .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1975, 22 (11) :1017-1023
[8]  
Verdonckt-Vandebroek S., 1988, International Electron Devices Meeting. Technical Digest (IEEE Cat. No.88CH2528-8), P406, DOI 10.1109/IEDM.1988.32842