NOVEL PROCESS FOR INTEGRATION OF OPTOELECTRONIC DEVICES USING REACTIVE ION ETCHING WITHOUT CHLORINATED GAS

被引:64
作者
HENRY, L [1 ]
VAUDRY, C [1 ]
GRANJOUX, P [1 ]
机构
[1] ALCATEL CIT,DIV IND,F-92240 MALAKOFF,FRANCE
关键词
DRY ETCHING - ETCHING GAS - III-V COMPOUND SEMICONDUCTORS - MICRO-OPTOELECTRONIC TECHNOLOGY - REACTIVE ION ETCHING;
D O I
10.1049/el:19870870
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:1253 / 1254
页数:2
相关论文
共 9 条
  • [1] REACTIVE ION ETCHING OF GAAS USING A MIXTURE OF METHANE AND HYDROGEN
    CHEUNG, R
    THOMS, S
    BEAMONT, SP
    DOUGHTY, G
    LAW, V
    WILKINSON, CDW
    [J]. ELECTRONICS LETTERS, 1987, 23 (16) : 857 - 859
  • [2] DEMEO N, 1985, NUCL INSTRUM METHO B, V7
  • [3] PLASMA-ETCHING OF III-V-COMPOUND SEMICONDUCTORS
    DONNELLY, VM
    FLAMM, DL
    IBBOTSON, DE
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1983, 1 (02): : 626 - 628
  • [4] HENRY L, Patent No. 8707135
  • [5] GALNAS JUNCTION FET FULLY DRY ETCHED BY METAL ORGANIC REACTIVE ION ETCHING TECHNIQUE
    LECROSNIER, D
    HENRY, L
    LECORRE, A
    VAUDRY, C
    [J]. ELECTRONICS LETTERS, 1987, 23 (24) : 1254 - 1255
  • [6] Niggebrugge U., 1985, I PHYS C SER, V79, P367
  • [7] REACTIVE ION ETCHING OF GAAS AND INP USING SICL4
    STERN, MB
    LIAO, PF
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1983, 1 (04): : 1053 - 1055
  • [8] HIGH-POWER ETCHED-FACET LASERS
    TIHANYI, P
    WAGNER, DK
    VOLLMER, HJ
    ROZA, AJ
    HARDING, CM
    DAVIS, RJ
    WOLF, ED
    [J]. ELECTRONICS LETTERS, 1987, 23 (15) : 772 - 773
  • [9] VATUS J, 1986, IEEE T ED, V33