STRESS AND THERMAL-EXPANSION COEFFICIENT OF CHEMICAL-VAPOR-DEPOSITED GLASS FILMS

被引：66

作者：

SUNAMI, H

ITOH, Y

SATO, K

机构：

来源：

关键词：

D O I：

10.1063/1.1658622

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：5115 / &

共 12 条

[1]

ABORF JA, 1969, J ELECTROCHEM SOC, V116, P1732

[2] THERMAL EXPANSION OF SPUTTERED SILICON NITRIDE FILMS [J].

BURKHARDT, PJ ;

MARVEL, RF .

[3]

Campbell D. S., 1966, BASIC PROBLEMS THIN, P223

[4] STRESS ANISOTROPY IN EVAPORATED IRON FILMS [J].

FINEGAN, JD ;

HOFFMAN, RW .

[5] MEASUREMENT OF STRAINS AT SI-SIO2 INTERFACE [J].

JACCODINE, RJ ;

SCHLEGEL, WA .

[6]

LATHLAEN R, 1969, J ELECTROCHEM SOC, V116, P621

[7]

MCSKIMIN JJ, 1951, PHYS REV, V83, P1080

[8]

SCHAIBLE PM, 1968, THIN FILM DIELECTRIC, P577

[9]

Schlacter M., 1969, International electron devices meeting

[10] The tension of metallic films deposited by electrolysis [J].

Stoney, GG .