MICROSTRUCTURE MODIFICATION OF TIN BY ION-BOMBARDMENT DURING REACTIVE SPUTTER DEPOSITION

被引:304
作者
PETROV, I
HULTMAN, L
HELMERSSON, U
SUNDGREN, JE
GREENE, JE
机构
[1] LINKOPING UNIV,DEPT PHYS,THIN FILM GRP,S-58183 LINKOPING,SWEDEN
[2] UNIV ILLINOIS,DEPT MAT SCI,COORDINATED SCI LAB,URBANA,IL 61801
[3] UNIV ILLINOIS,MAT RES LAB,URBANA,IL 61801
关键词
D O I
10.1016/0040-6090(89)90713-X
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
引用
收藏
页码:299 / 314
页数:16
相关论文
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