ELECTROLESS GOLD BEAM LEAD PLATING

被引：10

作者：

SARD, R ^{[1
]}

OKINAKA, Y ^{[1
]}

WAGGENER, HA ^{[1
]}

机构：

[1] BELL TEL LBAS INC, MURRAY HILL, NJ 07974 USA

来源：

JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 1974年 / 121卷 / 01期

关键词：

D O I：

10.1149/1.2396831

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

引用

页码：62 / 66

页数：5

共 15 条

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[4] ELECTROLESS NICKEL PLATING ON SILICON [J].

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[6]

MILLER RC, 1972, OCT EL SOC EXT FALL, P558

[7] SOME PRACTICAL ASPECTS OF ELECTROLESS GOLD PLATING [J].

OKINAKA, Y ;

SARD, R ;

WOLOWODI.C ;

CRAFT, WH ;

RETAJCZY.TF .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1974, 121 (01) :56-62

[8] ELECTROCHEMICAL STUDY OF ELECTROLESS GOLD-DEPOSITION REACTION [J].

OKINAKA, Y .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1973, 120 (06) :739-744

[9]

Okinaka Y, 1970, PLATING, V57, P914

[10]

PUDVIN JF, 1958, TRANSISTOR TECHNOLOG, V3

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