COSPUTTERED ALUMINUM-RICH ALTA ALLOY FILMS

被引：4

作者：

SCHAUER, A ^{[1
]}

ROSCHY, M ^{[1
]}

机构：

[1] SIEMENS AG,UNTERNEHMENSBEREICH BAUELEMENTE,MUNICH,WEST GERMANY

来源：

IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING | 1973年 / PHP9卷 / 04期

关键词：

D O I：

10.1109/TPHP.1973.1136740

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：230 / 233

页数：4

共 12 条

[1]

CHILTON JM, 1972, P ELECTRONIC COMPONE, P67

[2]

DUCKWORTH RG, 1969, MRC SPUTTERING C BRI, P60

[3]

GERSTENBERG D, 1962, P ELECTRON COMPONETS, P57

[4]

Huber F., 1971, Proceedings of the 21st electronic components conference, P198

[5] ANODIC OXIDES OF TA-AL ALLOY FILMS [J].

MUTH, DG ;

SITARIK, JP .

JOURNAL OF APPLIED PHYSICS, 1971, 42 (12) :4941-&

[6] A NEW STRUCTURE IN TANTALUM THIN FILMS (VAPOR DEPOSITION SUPERCONDUCTIVITY SPUTTERING X-RAY DIFFRACTION E) [J].

READ, MH ;

ALTMAN, C .

APPLIED PHYSICS LETTERS, 1965, 7 (03) :51-&

[7]

SCHAUER A, 1972, THIN SOLID FILMS, V13, P442

[8] RF SPUTTERED BETA-TANTALUM AND BCC TANTALUM FILMS [J].

SCHAUER, A ;

ROSCHY, M .

THIN SOLID FILMS, 1972, 12 (02) :313-&

[9] ELECTRICAL AND STRUCTURAL PROPERTIES OF CO-SPUTTERED TANTALUM-ALUMINUM FILMS [J].

STEIDEL, CA .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1969, 6 (04) :694-&

[10] COMPOSITIONAL CONTROL OF TANTALUM-ALUMINUM ALLOY FILMS BY A DC BIASED, AC SPUTTERING TECHNIQUE [J].

STEIDEL, CA ;

JAFFE, D ;

KUMAGAI, HY .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1972, 9 (01) :346-&

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