VOID MARKER MOTION DURING ELECTROMIGRATION IN SN-IN THIN FILMS

[1] REDUCTION OF ELECTROMIGRATION IN ALUMINUM FILMS BY COPPER DOPING [J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1970, 14 (04) : 461 - +

[2] ELECTROMIGRATION DAMAGE IN ALUMINUM FILM CONDUCTORS [J]. JOURNAL OF APPLIED PHYSICS, 1970, 41 (06) : 2381 - +

[3] BLACK JR, 1969, IEEE T ELECTRON DEVI, VED16, P338

[4] ELECTROMIGRATION IN THIN AL FILMS [J]. JOURNAL OF APPLIED PHYSICS, 1969, 40 (02) : 485 - &

[5] HARTMAN TE, 1969, IEEE T ELECTRON DEVI, VED16, P407

[6] HEHENKAMP T, 1966, THESIS MUNSTER

[7] HILLOCKS AS STRUCTURAL MARKERS FOR ELECTROMIGRATION RATE MEASUREMENTS IN THIN FILMS [J]. APPLIED PHYSICS LETTERS, 1971, 18 (08) : 344 - &

[8] THEORY OF IMPURITY DIFFUSION IN METALS [J]. PHILOSOPHICAL MAGAZINE, 1962, 7 (73) : 141 - +

[9] THE INFLUENCE OF SOLUTES ON SELF-DIFFUSION IN METALS [J]. PHILOSOPHICAL MAGAZINE, 1960, 5 (59): : 1171 - 1180

[10] OHRING M, TO BE PUBLISHED

[1] REDUCTION OF ELECTROMIGRATION IN ALUMINUM FILMS BY COPPER DOPING [J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1970, 14 (04) : 461 - +

[2] ELECTROMIGRATION DAMAGE IN ALUMINUM FILM CONDUCTORS [J]. JOURNAL OF APPLIED PHYSICS, 1970, 41 (06) : 2381 - +

[3] BLACK JR, 1969, IEEE T ELECTRON DEVI, VED16, P338

[4] ELECTROMIGRATION IN THIN AL FILMS [J]. JOURNAL OF APPLIED PHYSICS, 1969, 40 (02) : 485 - &

[5] HARTMAN TE, 1969, IEEE T ELECTRON DEVI, VED16, P407

[6] HEHENKAMP T, 1966, THESIS MUNSTER

[7] HILLOCKS AS STRUCTURAL MARKERS FOR ELECTROMIGRATION RATE MEASUREMENTS IN THIN FILMS [J]. APPLIED PHYSICS LETTERS, 1971, 18 (08) : 344 - &

[8] THEORY OF IMPURITY DIFFUSION IN METALS [J]. PHILOSOPHICAL MAGAZINE, 1962, 7 (73) : 141 - +

[9] THE INFLUENCE OF SOLUTES ON SELF-DIFFUSION IN METALS [J]. PHILOSOPHICAL MAGAZINE, 1960, 5 (59): : 1171 - 1180

[10] OHRING M, TO BE PUBLISHED