SILICON MICROVELCRO

被引：17

作者：

REED, ML ^{[1
]}

HAN, HT ^{[1
]}

WEISS, LE ^{[1
]}

机构：

[1] CARNEGIE MELLON UNIV,INST ROBOT,PITTSBURGH,PA 15213

来源：

ADVANCED MATERIALS | 1992年 / 4卷 / 01期

关键词：

D O I：

10.1002/adma.19920040111

中图分类号：

O6 [化学];

学科分类号：

0703 ;

摘要：

Research News: Silicon micromachining technology has been employed to fabricate dense, regular arrays of microstructures which act as mechanical adhesives. Structures such as that shown in the figure have potential applications in the biocompatible bonding of human tissue during surgery, their barb-like nature preventing retraction. A second approach, using mating structures, provides precision self-alligning, room-temperature bonding with potential in the mounting of integrated circuit chips.

引用

页码：48 / 51

页数：4

共 6 条

[1] SILICON-ON-INSULATOR WAFER BONDING-WAFER THINNING TECHNOLOGICAL EVALUATIONS [J].