FOCUSED ELECTRON AND ION-BEAM REPAIR STRATEGIES FOR WAFER-SCALE INTERCONNECTIONS IN THIN-FILM PACKAGING

被引：1

作者：

LIN, HT

MCDONALD, JF

CORELLI, JC

BALAKRISHNAN, S

KING, N

机构：

来源：

THIN SOLID FILMS | 1988年 / 166卷 / 1-2期

关键词：

D O I：

10.1016/0040-6090(88)90372-0

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：121 / 130

页数：10

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