SUBMICROMETER-LINEWIDTH DOPING AND RELIEF DEFINITION IN SILICON BY LASER-CONTROLLED DIFFUSION

[1] EHRLICH DJ, 1980, APPL PHYS LETT, V36, P916, DOI 10.1063/1.91366

[2] LASER CHEMICAL TECHNIQUE FOR RAPID DIRECT WRITING OF SURFACE RELIEF IN SILICON [J]. APPLIED PHYSICS LETTERS, 1981, 38 (12) : 1018 - 1020

[3] LASER PHOTOCHEMICAL MICROALLOYING FOR ETCHING OF ALUMINUM THIN-FILMS [J]. APPLIED PHYSICS LETTERS, 1981, 38 (06) : 399 - 401

[4] FORMATION OF STACKING-FAULTS AND ENHANCED DIFFUSION IN OXIDATION OF SILICON [J]. JOURNAL OF APPLIED PHYSICS, 1974, 45 (04) : 1567 - 1573

[5] THIN SILICON FILM ON INSULATING SUBSTRATE [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1973, 120 (11) : 1563 - 1566

[6] TEMPERATURE RISE INDUCED BY A LASER-BEAM [J]. JOURNAL OF APPLIED PHYSICS, 1977, 48 (09) : 3919 - 3924

[7] LAX M, 1979, LASER SOLID INTERACT

[8] TEMPERATURE DISTRIBUTIONS PRODUCED IN SEMICONDUCTORS BY A SCANNING ELLIPTICAL OR CIRCULAR CW LASER-BEAM [J]. JOURNAL OF APPLIED PHYSICS, 1980, 51 (01) : 274 - 279

[9] Shewmon P, 2016, DIFFUSION SOLIDS, DOI [10.1007/978-3-319-48206-4, DOI 10.1007/978-3-319-48206-4]

[1] EHRLICH DJ, 1980, APPL PHYS LETT, V36, P916, DOI 10.1063/1.91366

[2] LASER CHEMICAL TECHNIQUE FOR RAPID DIRECT WRITING OF SURFACE RELIEF IN SILICON [J]. APPLIED PHYSICS LETTERS, 1981, 38 (12) : 1018 - 1020

[3] LASER PHOTOCHEMICAL MICROALLOYING FOR ETCHING OF ALUMINUM THIN-FILMS [J]. APPLIED PHYSICS LETTERS, 1981, 38 (06) : 399 - 401

[4] FORMATION OF STACKING-FAULTS AND ENHANCED DIFFUSION IN OXIDATION OF SILICON [J]. JOURNAL OF APPLIED PHYSICS, 1974, 45 (04) : 1567 - 1573

[5] THIN SILICON FILM ON INSULATING SUBSTRATE [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1973, 120 (11) : 1563 - 1566

[6] TEMPERATURE RISE INDUCED BY A LASER-BEAM [J]. JOURNAL OF APPLIED PHYSICS, 1977, 48 (09) : 3919 - 3924

[7] LAX M, 1979, LASER SOLID INTERACT

[8] TEMPERATURE DISTRIBUTIONS PRODUCED IN SEMICONDUCTORS BY A SCANNING ELLIPTICAL OR CIRCULAR CW LASER-BEAM [J]. JOURNAL OF APPLIED PHYSICS, 1980, 51 (01) : 274 - 279

[9] Shewmon P, 2016, DIFFUSION SOLIDS, DOI [10.1007/978-3-319-48206-4, DOI 10.1007/978-3-319-48206-4]