ALUMINUM-ALLOY FILM DEPOSITION AND CHARACTERIZATION

被引：24

作者：

LEARN, AJ ^{[1
]}

机构：

[1] FAIRCHILD CAMERA & INSTR CORP,RES & DEV LAB,PALO ALTO,CA 94304

来源：

关键词：

D O I：

10.1016/0040-6090(74)90062-5

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：261 / 279

页数：19

共 22 条

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[3] REDUCTION OF ELECTROMIGRATION IN ALUMINUM FILMS BY COPPER DOPING
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[6] STUDY OF FAILURE MECHANISMS IN AL-CU THIN FILMS BY HIGH-VOLTAGE ELECTRON MICROSCOPY
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[10] EFFECT OF COPPER ADDITIONS ON ELECTROMIGRATION IN ALUMINUM THIN FILMS
DHEURLE, FM
[J]. METALLURGICAL TRANSACTIONS, 1971, 2 (03): : 683 - &