DEGRADATION OF GAIN IN BIPOLAR-TRANSISTORS

被引:10
作者
KIZILYALLI, IC [1 ]
BUDE, JD [1 ]
机构
[1] AT&T BELL LABS,ULST TECHNOL RES DEPT,MURRAY HILL,NJ 07974
关键词
D O I
10.1109/16.293334
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper hot carrier related aging of n-p-n bipolar transistors is investigated experimentally and theoretically in order to bring physical insight into the bipolar h(FE) (common emitter current gain) degradation. Electrical stress experiments are performed on transistors with different base doping profiles at varying temperatures. Detailed process simulations are performed to determine the doping profiles of the base-emitter junction. Monte Carlo transport simulations are then performed at different temperatures and bias conditions to determine the electron and hole distribution functions in the base-emitter junction. AT&T's 0.8mum BICMOS technology is used to fabricate the experimental bipolar structures. For this non-self aligned technology we attribute h(FE) degradation to the presence of hot holes and secondary electrons which are generated by hot hole impact ionization. This feedback due to impact ionization has a dominant effect on the high energy tails of the distribution of both holes and electrons even when the overall current multiplication is low. Simple hot electron energy transport models do not contain the complexity to properly describe ionization feedback and carrier heating, and are therefore inadequate. An exponential dependence of the transistor lifetime on BV(EBO) is deduced for constant voltage stress (V(stress) < BV(EBO)) conditions, confirming the importance of secondaries in the process of degradation.
引用
收藏
页码:1083 / 1091
页数:9
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