Microwave plasma oxidation of strained Si1-xGex layer has been carried out at low temperatures (150-200-degrees-C). The chemical properties of the oxide investigated by x-ray photoelectron spectroscopy show the formation of single phase mixed oxides consisting a SiO2 and GeO2, without any Ge pileup on the surface or at the substrate-oxide interface. Electrical properties of the oxides show a moderately low value of fixed oxide charge and interface trap density. Grown oxides exhibit low leakage current (10(-8) A/cm2) and high breakdown strength (5-10 MV/cm), and are useful for a gate dielectric in metal-oxide semiconductor field effect transistor.