THERMAL-STRESS ANALYSIS OF A MULTICHIP PACKAGE DESIGN

被引：26

作者：

DARVEAUX, R

TURLIK, I

HWANG, LT

REISMAN, A

机构：

[1] N CAROLINA STATE UNIV,DEPT MAT SCI & ENGN,RALEIGH,NC 27709

[2] BELL NO RES,RES TRIANGLE PK,NC 27709

[3] N CAROLINA STATE UNIV,DEPT ELECT & COMP ENGN,RALEIGH,NC 27695

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1989年 / 12卷 / 04期

关键词：

D O I：

10.1109/33.49031

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：663 / 672

页数：10

共 6 条

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[2] A THERMAL MODULE DESIGN FOR ADVANCED PACKAGING [J].

HWANG, LT ;

TURLIK, I ;

REISMAN, A .

JOURNAL OF ELECTRONIC MATERIALS, 1987, 16 (05) :347-355

[3] A HIGH-PERFORMANCE THERMAL MODULE FOR COMPUTER PACKAGING [J].

NAYAK, D ;

HWANG, LT ;

TURLIK, I ;

REISMAN, A .

JOURNAL OF ELECTRONIC MATERIALS, 1987, 16 (05) :357-364

[4]

NAYAK D, IN PRESS IEEE T COMP

[5] A CONDUCTION-COOLED MODULE FOR HIGH-PERFORMANCE LSI DEVICES [J].

OKTAY, S ;

KAMMERER, HC .

IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1982, 26 (01) :55-66

[6]

VLSI SYSTEMS 1988 SE, P106

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