THERMAL-ANALYSIS OF A MULTI-CHIP PACKAGE DESIGN

被引：9

作者：

DARVEAUX, R

HWANG, LT

REISMAN, A

TURLIK, I

机构：

[1] N CAROLINA STATE UNIV,DEPT MAT SCI & ENGN,RALEIGH,NC 27695

[2] N CAROLINA STATE UNIV,DEPT ELECTR & COMP ENGN,RALEIGH,NC 27650

[3] BELL NO RES,RES TRIANGLE PK,NC 27709

来源：

JOURNAL OF ELECTRONIC MATERIALS | 1989年 / 18卷 / 02期

关键词：

D O I：

10.1007/BF02657418

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：267 / 274

页数：8

共 20 条

[1]

Antonetti V. W., 1984, International Journal for Hybrid Microelectronics, V7, P44

[2] THERMAL MANAGEMENT OF AIR-COOLED AND LIQUID-COOLED MULTICHIP MODULES [J].

BARCOHEN, A .

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1987, 10 (02) :159-175

[3]

DARVEAUX RF, IN PRESS

[4]

Dongarra JJ, 1979, LINPACK USERS GUIDE

[5] A THERMAL MODULE DESIGN FOR ADVANCED PACKAGING [J].

HWANG, LT ;

TURLIK, I ;

REISMAN, A .

JOURNAL OF ELECTRONIC MATERIALS, 1987, 16 (05) :347-355

[6]

INCROPERA FP, 1981, FUNDAMENTALS HEAT TR

[7] THERMAL PROPERTIES OF VERY FAST TRANSISTORS [J].

JOY, RC ;

SCHLIG, ES .

IEEE TRANSACTIONS ON ELECTRON DEVICES, 1970, ED17 (08) :586-&

[8]

Kays W.M, 1980, CONVECTIVE HEAT MASS

[9]

LEE YC, P IEEE 1988 EL COMP, P293

[10] A HIGH-PERFORMANCE THERMAL MODULE FOR COMPUTER PACKAGING [J].

NAYAK, D ;

HWANG, LT ;

TURLIK, I ;

REISMAN, A .

JOURNAL OF ELECTRONIC MATERIALS, 1987, 16 (05) :357-364

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