ELECTRICAL CHARACTERISTICS OF COPPER POLYIMIDE THIN-FILM MULTILAYER INTERCONNECTS

被引：4

作者：

LANE, TA

BELCOURT, FJ

JENSEN, RJ

机构：

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1987年 / 10卷 / 04期

关键词：

D O I：

10.1109/TCHMT.1987.1134780

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：577 / 585

页数：9

共 12 条

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[2]

EDEN RC, 1980, VERY LARGE SCALE INT, P163

[3]

HOWE H, 1979, STRIPLINE CIRCUIT DE, pCH2

[4] COPPER POLYIMIDE MATERIALS SYSTEM FOR HIGH-PERFORMANCE PACKAGING [J].

JENSEN, RJ ;

CUMMINGS, JP ;

VORA, H .

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1984, 7 (04) :384-393

[5]

LANE T, 1986, TFML RING OSCILLATOR

[6]

Matick R.E., 1969, TRANSMISSION LINES D

[7]

McKay J. E., 1976, Electronic Design, V24, P136

[8] PROPERTIES OF THIN POLYIMIDE FILMS [J].

ROTHMAN, LB .

[9]

Sainati R., 1985, 35th Electronic Components Conference (Cat. No. 85CH2184-0), P365

[10]

Tsunetsugu H., 1985, International Journal for Hybrid Microelectronics, V8, P21