RESIDUAL-STRESS MEASUREMENTS OF THIN ALUMINUM METALLIZATIONS BY CONTINUOUS INDENTATION AND X-RAY STRESS MEASUREMENT TECHNIQUES

被引：80

作者：

LAFONTAINE, WR ^{[1
]}

PASZKIET, CA ^{[1
]}

KORHONEN, MA ^{[1
]}

LI, CY ^{[1
]}

机构：

[1] CORNELL UNIV,DEPT MAT SCI & ENGN,ITHACA,NY 14853

来源：

JOURNAL OF MATERIALS RESEARCH | 1991年 / 6卷 / 10期

关键词：

D O I：

10.1557/JMR.1991.2084

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Stress relaxation in aluminum films of several thicknesses was characterized by using both continuous indentation and x-ray diffraction techniques. Results of the indentation and x-ray stress measurements compare closely for films of small thicknesses. Indentation data from thicker films do not compare well to the x-ray data due to the presence of a residual stress distribution.

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页码：2084 / 2090

页数：7

相关论文

共 17 条

[1] MECHANICAL STRENGTH OF THIN FILMS OF METALS [J].

BEAMS, JW ;

BREAZEALE, JB ;

BART, WL .

PHYSICAL REVIEW, 1955, 100 (06) :1657-1661

[2] A method for interpreting the data from depth-sensing indentation instruments [J].

Doerner, M. F. ;

Nix, W. D. .

JOURNAL OF MATERIALS RESEARCH, 1986, 1 (04) :601-609

[3] Plastic properties of thin films on substrates as measured by submicron indentation hardness and substrate curvature techniques [J].

Doerner, M. F. ;

Gardner, D. S. ;

Nix, W. D. .

JOURNAL OF MATERIALS RESEARCH, 1986, 1 (06) :845-851

[4] STRAIN DISTRIBUTION IN THIN ALUMINUM FILMS USING X-RAY DEPTH PROFILING [J].

DOERNER, MF ;

BRENNAN, S .

JOURNAL OF APPLIED PHYSICS, 1988, 63 (01) :126-131

[5] MEASUREMENT AND INTERPRETATION OF STRESS IN ALUMINUM-BASED METALLIZATION AS A FUNCTION OF THERMAL HISTORY [J].

FLINN, PA ;

GARDNER, DS ;

NIX, WD .

IEEE TRANSACTIONS ON ELECTRON DEVICES, 1987, 34 (03) :689-699

[6]

Hoffman R. W, 1966, PHYS THIN FILMS, V3, P211

[7] STRESS-RELAXATION OF PASSIVATED ALUMINUM LINE METALLIZATIONS ON SILICON SUBSTRATES [J].

KORHONEN, MA ;

BLACK, RD ;

LI, CY .

JOURNAL OF APPLIED PHYSICS, 1991, 69 (03) :1748-1755

[8] STRESS-RELAXATION OF CONTINUOUS FILM AND NARROW LINE METALLIZATIONS OF ALUMINUM ON SILICON SUBSTRATES [J].

KORHONEN, MA ;

PASZKIET, CA ;

BLACK, RD ;

LI, CY .

SCRIPTA METALLURGICA ET MATERIALIA, 1990, 24 (12) :2297-2302

[9] X-RAY DETERMINATION OF THE RESIDUAL-STRESSES IN THIN ALUMINUM FILMS DEPOSITED ON SILICON SUBSTRATES [J].

KORHONEN, MA ;

PASZKIET, CA .

SCRIPTA METALLURGICA, 1989, 23 (08) :1449-1453

[10] INDENTATION LOAD RELAXATION EXPERIMENTS WITH INDENTATION DEPTH IN THE SUBMICRON RANGE [J].

LAFONTAINE, WR ;

YOST, B ;

BLACK, RD ;

LI, CY .

JOURNAL OF MATERIALS RESEARCH, 1990, 5 (10) :2100-2106